Intel’s 916,000-pound shipment is a “cold box,” a self-standing air-processor structure that facilitates the cryogenic technology needed to fabricate semiconductors. The box is 23 feet tall, 20 feet wide, and 280 feet long, nearly the length of a football field. The immense scale of the cold box necessitates a transit process that moves at a “parade pace” of 5-10 miles per hour. Intel is taking over southern Ohio’s roads for the next several weeks and months as it builds its new Ohio One Campus, a $28 billion project to create a 1,000-acre campus with two chip factories and room for more. Calling it the new “Silicon Heartland,” the project will be the first leading-edge semiconductor fab in the American Midwest, and once operational, will get to work on the “Angstrom era” of Intel processes, 20A and beyond.
I don’t know why, but I’ve never thought of the transport logistics involved in building a semiconductor fabrication plant.
Angstrom was invented in physics because they needed a length unit that was smaller than SI prefixes would allow. The industry only picked it up once they got to a certain level.
(Contrary to what a lot of people think, physicists do not strictly follow SI. They bypass it for reasons of convenience all the time.)